会议主题 Subject OpenHarmony 架构SIG 会议时间 Time 2022-12-13 9:30-12:00(UTC+08:00)Beijing 召集人 Convener 任革林 视频会议 Video Meeting 加入会议： Join (Internal) https://imeeting.huawei.com/meeting/join?id=0201559358&app=welink§ype=0 Join (External) https://welink.zhumu.com/j/201559358 会议ID： 0201559358 与会人 Attendees 万承臻；任革林；赵文华；强波；董金光 外部与会人 External Participants dev@openharmony.iomailto:dev@openharmony.io；minglong@iscas.ac.cn；kelei@iscas.ac.cn 会议议题 Agenda 编号No. 议题名称Topic 时长Duration 汇报人Reporter 隶属SIG 议题参与人Members 1 Ingenic平台sig仓：vendor_ingenic、device_board_ingenic、device_soc_ingenic 孵化毕业申请 15 袁祥仁 xiangren.yuan@ingenic.commailto:xiangren.yuan@ingenic.com Devboard SIG 2 SIG仓申请毕业孵化合入主干：device_board_ubtech，device_soc_asr，vendor_ubtech 15 曾庆彬zengqingbin@ub-tech.cnmailto:曾庆彬zengqingbin@ub-tech.cn Devboard SIG 黄亚敏huangyamin@ub-tech.cnmailto:黄亚敏huangyamin@ub-tech.cn 3 SIG仓申请毕业孵化合入主干：device_board_ ubtech，device_soc_xinsheng，vendor_UB 15 曾庆彬zengqingbin@ub-tech.cnmailto:曾庆彬zengqingbin@ub-tech.cn Devboard SIG 4 sig仓申请孵化毕业：applications_compass，applications_recorder，applications_clock 15 刘刚 liu_gang1@hoperun.commailto:liu_gang1@hoperun.com 邵君烨 shao_junye@hoperun.commailto:shao_junye@hoperun.com SIG_SystemApplication 5 sig仓申请孵化毕业：device_board_hihope，device_soc_beken，vendor_hihope 15 金练 jin_lian@hoperun.commailto:jin_lian@hoperun.com Devboard SIG 6 新建SIG仓：coap 15 陈宝迪chenbaodi@huawei.commailto:陈宝迪chenbaodi@huawei.com tpc-sig 刘宝玉 liubaoyu1@huawei.commailto:liubaoyu1@huawei.com 陈文杰 chenwenjie.chenwenjie@huawei.commailto:chenwenjie.chenwenjie@huawei.com 朱志辉 zhuzhihui7@huawei.commailto:zhuzhihui7@huawei.com 7 新建SIG仓：Mbassador 15 田勇 tianyong13@huawei.commailto:tianyong13@huawei.com tpc-sig 刘宝玉 liubaoyu1@huawei.commailto:liubaoyu1@huawei.com 陈文杰 chenwenjie.chenwenjie@huawei.commailto:chenwenjie.chenwenjie@huawei.com 朱志辉 zhuzhihui7@huawei.commailto:zhuzhihui7@huawei.com 8 新建SIG仓：tangram 15 周黎生 zhoulisheng1@huawei.commailto:zhoulisheng1@huawei.com tpc-sig 刘宝玉 liubaoyu1@huawei.commailto:liubaoyu1@huawei.com 陈文杰 chenwenjie.chenwenjie@huawei.commailto:chenwenjie.chenwenjie@huawei.com 朱志辉 zhuzhihui7@huawei.commailto:zhuzhihui7@huawei.com 议题申报链接 https://shimo.im/sheets/StzhuFkEk38enrnl/MODOC